Nov 2022: Dr. Bang Nguyen has successfully defended his Ph.D. dissertation on Nov 30, 2022. Congrats, Dr. Nguyen.
March 2022: Dr. Vu will serve as a member of the Early Career Advisory Board of Control Engineering Practice (CEP) Journal from April 2022 to March 2023
Jan 2022: Congratulations to Mr. Shahalam Naqvi for completing his master's degree. Shahalam will start working for Leidos Engineering as a distribution planning and analysis engineer in Jan 2022.
Dec 2021: Mr. Bang Nguyen passed the proposal defense. Congrats, Bang.
Dec 2021: Mr. MD Isfakul Anam passed the preliminary exam. Congrats, Isfakul.
June 18, 2021: Our paper [Tuyen V. Vu, Bang L.H. Nguyen, Zheyuan Cheng, Mo-Yuen Chow and Bin Zhang, ”Cyber-Physical Microgrids - Toward Future Resilient Communities,” IEEE Industrial Electronics Magazine, pp.4-17, Sept. 2020.] has been selected to receive the 2021 Prize Paper Award for the IEEE Industrial Electronics Magazine. Congratulations, to the team.
June 18, 2021: Bang has a long-term internship at National Renewable Energy Laboratory. Congrats, Bang.
March 1, 2021: Dr. Vu will work as a Summer Faculty Fellow at the Naval Surface Warfare Center Philadephia (NSWCPD) under the 2021 ONR Summer Faculty Research Program (SFRP) during Summer 2021.
Dec 7, 2020: Mr. Shahalam Naqvi has an internship at Tesla in Palo Alto. Congrats, Shahalam.
Nov 6, 2020: Our offshore wind project is on the news
April 24, 2020: Dr. Vu will serve as the publication chair for the IEEE Electric Ship Technologies Symposium (ESTS 2021)
Dec 4, 2019: Mr. Bang Nguyen passed the preliminary exam. Congrats, Bang.
May 20, 2019: Congratulations to Everett Hall for his successful Master Thesis's Defense on Design and Simulation of Potsdam Microgrid Models. Everett will start working for Eversource-Massachusetts in Distributed Generations in May 2019.
April 1, 2019: Dr. Vu will co-chair the special session on DC Shipboard Power Systems for the future All-Electric Ships. The submission deadline is May 15, 2019
Jan 28, 2019: Dr. Vu is a guest editor of the Transactions on Industrial Informatics-Special Issue on Resilience, Reliability, and Security in Cyber-Physical Systems. The submission deadline is May 31, 2019